Date:
November 4-6, 2025
Venue:
Faculty of Engineering, Hokkaido University, Kita-13, Nishi-8, Kita-ku Sapporo Japan
(Academic Lounge 3, room A1-17, Room A1-70)
Participating University:
- The Hong Kong Polytechnic University
- Korea University
- National Cheng Kung University
- Hokkaido University
Registration fee:
- Standard 20,000 JPY
- Student 10,000 JPY
- Accompanying 10,000 JPY
Important dates:
- Abstract submission; September 15, 2025
- Notification date; September 22, 2025
Abstract submission:
Using the provided template, please submit your abstract (PDF) as an email attachment to the following address by the specified deadline.
Email address for submission: eamae2025(at)eng.hokudai.ac.jp
*For inquiries regarding the symposium, please contact us at the above address.